View PKFC33C_1115994.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

05180
PKFC3.3C*
thru
Only One Name Means ProT ek'TionTM
PKFC36C*
PACKAGED FLIP CHIP ARRA Y
APPLICA TIONS Cellular Phones MCM Boards Wireless Communication Circuits IR LEDs SMART & PCMCIA Cards IEC COMPA TIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns FEA TURES
CHIP SCALE PACKAGE 0.050" (1.270mm) x 0.030" (0.762mm) ESD Protection > 25 kilovolts Available in Multiple Voltage Types Ranging From 3.3V to 36V 250 Watts Peak Pulse Power per Line (tp = 8/20s) Bidirectional Configuration & Monolithic Structure Protects 1 Line RoHS Compliant in Lead-Free Versions
MECHANICAL CHARACTERISTICS Encapsulated 0502 Chip Weight 0.73 milligrams (Approximate) Available in Tin-Lead or Lead-Free Pure-Tin Plating(Annealed) Solder Reflow Temperature: Tin-Lead - Sn/Pb, 85/15: 240-245C Pure-Tin - Sn, 100: 260-270C Flammability Rating UL 94V-0 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 Device Marking On Reel PIN CONFIGURA TION
*PA TENT PENDING"
05180.R3 12/05
1
www.protekdevices.com
PKFC3.3C*
thru
PKFC36C*
DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25C Unless Otherwise Specified
PARAMETER Peak Pulse Power (tp = 8/20s) - See Figure 1 Operating Temperature Storage Temperature SYMBOL PPP TJ TSTG VALUE 250 -55C to 150C -55C to 150C UNITS Watts C C
ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified
PART NUMBER (See Note 1) DEVICE MARKING CODE RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) @ IP = 1A VC VOLTS 7.0 9.8 13.4 19.0 24.0 43.0 64.0 MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM LEAKAGE CURRENT (See Note 2) @VWM ID A 75* 10** 10*** 1 1 1 1 TYPICAL CAPACITANCE
VWM VOLTS PKFC3.3C PKFC05C PKFC08C PKFC12C PKFC15C PKFC24C PKFC36C 03 05 08 12 15 24 36 3.3 5.0 8.0 12.0 15.0 24.0 36.0
@ 1mA V(BR) VOLTS 4.0 6.0 8.5 13.3 16.7 26.7 40.0
@8/20s VC @ IPP 12.5V @ 20A 14.7V @ 17A 19.2V @ 13A 29.7V @ 9.0A 35.7V @ 7.0A 55.0V @ 5.0A 84.0V @ 3.0A
@0V, 1 MHz C pF 150 100 75 50 40 30 25
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Note 2: *Typical leakage current < 5A @ 2.8V. **Typical leakage current <500nA @ 3.3V. ***Typical leakage current <200nA @ 5V.
FIGURE 1 PEAK PULSE POWER VS PULSE TIME
10,000
IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts
120 100 80 60 40 20 0 tf
FIGURE 2 PULSE WAVE FORM
Peak Value IPP TEST WAVEFORM PARAMETERS tf = 8s td = 20s
1,000 250W, 8/20s Waveform
e-t
100
td = t I /2 PP
10 0.01
1
10 100 td - Pulse Duration - s
1,000
10,000
0
5
10
15 t - Time - s
20
25
30
*PA TENT PENDING
05180.R3 12/05
2
www.protekdevices.com
PKFC3.3C*
thru
PKFC36C*
GRAPHS
FIGURE 3 POWER DERATING CURVE
Peak Pulse Power 8/20s
100 80
% Of Rated Power
60
40 20 Average Power 0 0 25 50 75 100 125 TL - Lead Temperature - C 150
FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR PKFC05C
35
5 Volts per Division
25
15
5
-5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
14
VC - Clamping Voltage - Volts
FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR PKFC05C
12 10 8 6 4 2 0 0 5 10 IPP - Peak Pulse Current - Amps
*PA TENT PENDING
15
20
05180.R3 12/05
3
www.protekdevices.com
PKFC3.3C*
thru
PKFC36C*
APPLICA TION INFORMA TION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Soldering Maximum Temperature
VALUE
0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C
REQUIREMENTS
Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating.
RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad 0.275mm DIA.
Solder Mask Opening 0.325mm DIA.
Solder Stencil Opening 0.330mm DIA.
TP Ramp-up
Temperature - C
Ramp-down TL TSMAX 155 TSMIN 140 TS - Preheat
t 25C to Peak 30-60 seconds
Ramp-up 15 seconds
4
Solder Time 15-20 seconds
Ramp-down
*PA TENT PENDING
05180.R3 12/05
www.protekdevices.com
PKFC3.3C*
thru
PKFC36C*
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
DIM
A H C A B C D E F G H J K
PACKAGE DIMENSIONS
MILLIMETERS MIN NOM MAX
0.73 1.22 0.73 0.54 0.10 0.55 0.27 0.38 0.35 0.35 0.76 1.27 0.76 0.57 0.13 0.58 0.30 0.41 0.38 0.38 0.79 1.32 0.79 0.60 0.16 0.61 0.33 0.44 0.41 0.41
INCHES MIN
0.029 0.048 0.029 0.021 0.004 0.022 0.011 0.015 0.014 0.014
NOM
0.030 0.050 0.030 0.023 0.005 0.023 0.012 0.016 0.015 0.015
MAX
0.031 0.052 0.031 0.024 0.006 0.024 0.013 0.017 0.016 0.016
D K TOP B BOTTOM E SIDE
J
F
G
NOTES 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad : 0.003" ( 0.08mm). 3. Maximum size: 0.052" (1.321mm) by 0.036" (0.914mm). 4. All dimensions 0.003" on package outline.
MOUNTING PAD
A
PAD DIMENSIONS
DIM
A B C E F G J
MILLIMETERS MIN NOM MAX
1.00 0.62 1.44 0.18 0.49 0.31 0.31 1.02 0.64 1.47 0.20 0.51 0.33 0.33 1.04 0.66 1.50 0.22 0.53 0.35 0.35
MIN
0.039 0.024 0.056 0.007 0.019 0.012 0.012
INCHES NOM MAX
0.040 0.025 0.058 0.008 0.020 0.013 0.013 0.041 0.026 0.060 0.009 0.021 0.014 0.014
G B
F
E
C
TAPE & REEL ORIENTATION
Package Outline J
XX
Solder Print Diameter 0.010" - 0.012" TAPE & REEL ORDERING NOMENCLATURE
Package Contact Pads
1. Surface mount product is taped and reeled in accordance with EIA 481. 2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., PKFC05C-T75-1). 3. Suffix - LF = Lead-Free, Pure-Tin Plating, i.e., PKFC05C-LF-T75-1.
NOTE 1. Top view of tape. Solder PADS face down in tape package. Outline & Dimensions: Rev 1 - 8/03, 06040
Tape & Reel Specifications (Dimensions in millimeters)
Reel Dia. 178mm (7") Tape Width 8mm A0 B0 K0 D E F W P0 P2 P t
1.08 0.05 1.60 0.05 0.72 0.05 1.50 0.10 1.75 0.10 3.50 0.05 8.00 0.30 4.00 0.10 2.00 0.05 4.00 0.10 0.200.025
P0 t D P2 10 Pitches Cumulative Tolerance on Tape. 0.2
E Top cover tape A0 K0 B0 F W
P
User Direction of Feed
COPYRIGHT (c) ProTek Devices 2005 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com
*PA TENT PENDING
05180.R3 12/05
5
www.protekdevices.com

▲Up To Search▲

Price & Availability of PKFC33C

	To Download PKFC33C Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .